Silicon Prime Wafers

Polished Wafers

Polished Wafers are produced by buffing etched Wafers using a chemical mechanical polishing method. Applications include, MOS-IC, Bipolar IC, CCD and a variety of memory chips.

COP Free Wafers

COP Free Wafers are none of COP(Crytal Originated Partcle), LDP(Large Dislocation Pit),and OSF(Oxidation induced Stacking Fault). Applications include, DRAM, Advanced devices.

Enhanced Gettered Wafers

This is a high quality wafer with superior gettering performance and enhanced cost effectiveness. Compared to Base-Side-Damaged Wafers, the EG Wafer has superior gettering performance even when contamination is present.
Applications include Flash Memory, DRAM, M/ROM, SRAM and a variety of logic devices.

Double side polished(DSP) Wafers

The main advantage of DSP wafers is their extremely low total thickness variation (TTV) which ensures uniform process behaviour. DSP wafers are used for sensors in MEMS (Microelectromechanical systems) applications.

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