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Epi Technical Service

Product Inquiry Form for Bonded SOI Wafers

Thank you for expressing interest in Epiwafer Website. We supply Bonded SOI wafers to all customers promptly. Here's a handy form to help define your wafers needs.
Send it to us and We'll get back to you.

Name	(Required)
Company	(Required)
Address
City
State
Zip Code
Country
Telephone Number	(Required)
Fax
E-Mail	(Required)
Comments (Required)
Please Annotate Your Critical Specification below on SOI Wafer
Bonded SOI wafers
Overall Wafer Specification
Quantity
Wafer Diameter	100mm 125mm 150mm 200mm
Base(Handle) Wafer Specification
Growth Method	CZ FZ No Preference
Orientation	(100),(111),(110),No Preference
Thickness(��)
Doping Type	N,P,No Preference
Resistivity(��-cm)
Backside finish	Polished,Lapped,Etched,No Preference
Buried Oxide(BOX) specification
Oxide Type	Thermal,Other
Oxide Thickness(��)
SOI(Device) Layer specification
Growth Method	CZ,FZ,No Preference
Orientation	(100),(111)
Thickness(��)
doping Type	N,P,No Preference
Resistivity(��-cm)
Please tell us about your additional specification on request and applications:

Address:#303, Hoseo Technology Center, San 29-1, Saechul-Ri, Baebang-Myun, Asan, Chungnam,336-795 Korea
Phone: 82-41-532-6922, 82-41-540-5323. FAX: 82-41-532-6921,E-Mail: jpma@jenesis.co.kr